Details, datasheet, quote on part number: THS6032CVFP
PartTHS6032CVFP
CategoryAnalog & Mixed-Signal Processing => Amplifiers => High Speed/Video Amplifiers => Line Drivers and Receivers
TitleLine Drivers and Receivers
Descriptionti THS6032, Low-power Adsl Central Office Line Driver
CompanyTexas Instruments, Inc.
DatasheetDownload THS6032CVFP datasheet
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Features, Applications

Central Office ­ 1.35-W Total Power Dissipation for Full-Rate ADSL Into a 25- Load Low-Impedance Shutdown Mode ­ Allows Reception of Incoming Signal During Standby Two Modes of Operation ­ Class-G Mode: 4 Power Supplies, 1.35 W Power Dissipation ­ Class-AB Mode: 2 Power Supplies, 2 W Power Dissipation Low Distortion ­ THD = ­62 dBc = 1 MHz, VO(PP) V, 25- Load ­ THD = ­69 dBc = 1 MHz, VO(PP) V, 25- Load 400-mA Minimum Output Current Into a 25- Load High Speed ­ 65-MHz Bandwidth , 25- Load ­ 100-MHz Bandwidth , 100- Load ­ 1200 V/µs Slew Rate Thermal Shutdown and Short Circuit Protection Evaluation Module Available

THERMALLY ENHANCED SOIC (DWP) PowerPAD PACKAGE (TOP VIEW)

NC ­ Not Connected This terminal is internally connected to the thermal pad. MicroStar Junior (GQE) PACKAGE (TOP VIEW)

description

The is a low-power line driver ideal for asymmetrical digital subscriber line (ADSL) applications. This device contains two high-current, high-speed current-feedback drivers, which can be configured differentially for driving ADSL signals at the central office. The THS6032 features a unique class-G architecture to lower power consumption 1.35 W. The THS6032 can also be operated in a traditional class-AB mode to reduce the number of power supplies to two.

HIGH-SPEED xDSL LINE DRIVER/RECEIVER FAMILY DEVICE THS6072 THS7002 DRIVER RECEIVER ±15 V DESCRIPTION 500-mA differential line driver and receiver 500-mA differential line driver 250-mA differential line driver 500-mA low-power ADSL central-office line driver Low-noise ADSL receiver Low-power ADSL receiver Low-noise programmable-gain ADSL receiver

CAUTION: The THS6032 provides ESD protection circuitry. However, permanent damage can still occur if this device is subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance degradation or loss of functionality. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD and MicroStar Junior are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

The class-G architecture supplies current to the load from four supplies. For low output voltages (typically < +2.5), some of the output current is supplied from the +VCC(L) and ­VCC(L) supplies (typically ± 5 V). For large output voltages (typically ­ 2.5 and + 2.5), the output current is supplied from +VCC(H) and ­VCC(H) (typically ± 15 V). This current sharing between VCC(L) and VCC(H) minimizes power dissipation within the THS6032 output stages for high crest factor ADSL signals. The THS6032 features a low-impedance shutdown mode, which allows the central office to receive incoming calls even after the device has been shut down. The THS6032 is available packaged in the patented PowerPAD package. This package provides outstanding thermal characteristics in a small-footprint surface-mount package, which is fully compatible with automated surface-mount assembly procedures. It is also available in the new MicroStar Junior BGA package. This package is only mm2 in area, allowing for high density PCB designs. Shutdown (SHDN1 and SHDN2) allows for powering down the internal circuitry for power conservation or for multiplexing. Separate shutdown controls are available for each channel on the THS6032. The control levels are TTL compatible. When turned off, each driver output is placed in a low impedance state which is determined by the voltage at DGND. This virtual ground at the outputs allows proper termination of a transmission line.

AVAILABLE OPTIONS PACKAGED DEVICES TA PowerPAD PLASTIC SMALL OUTLINE (DWP) THS6032CDWP MicroStar Junior BGA (GQE) THS6032CGQER PowerPAD TQFP (VFP) THS6032CVFP EVALUATION MODULES

to 85°C The DWP packages are available taped and reeled. Add an R suffix to the device type (i.e.,THS6032CDWPR) The GQE packages are only available taped and reeled.

TERMINAL NAME 2IN­ 2IN+ VCCH­ VCCH+ VCCL­ VCCL+ SHDN1 SHDN2 DGND PAD NC DWP PACKAGE TERMINAL NO. GQE PACKAGE TERMINAL NO. J4 J7 N/A VFP PACKAGE TERMINAL NO. N/A

MicroStar Junior (GQE) PACKAGE (TOP VIEW)

NOTE: Shaded terminals are used for thermal connection to the ground plane. VFP PACKAGE (TOP VIEW)

 

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