|Category||Semiconductors => Amplifiers => Operational Amplifiers (Op Amps) => High-Speed Op Amps (>=50MHz)|
|Part family||THS6032 Low-Power ADSL Central Office Line Driver|
|Title||Line Drivers and Receivers|
|Description||Low-Power ADSL Central Office Line Driver 20-SO PowerPAD 0 to 70|
|Company||Texas Instruments, Inc.|
|Datasheet||Download THS6032CDWP datasheet
|Input Bias Current(Max)(pA)||9000000|
|Iq per channel(Max)(mA)||10.8|
|Total Supply Voltage(Max)(+5V=5, +/-5V=10)||32|
|Total Supply Voltage(Min)(+5V=5, +/-5V=10)||10|
|Approx. Price (US$)||5.65 | 1ku|
|Acl, min spec gain(V/V)||1|
|Vos (Offset Voltage @ 25C)(Max)(mV)||5|
|Vn at 1kHz(Typ)(nV/rtHz)||2.8|
|Number of Channels(#)||2|
|Operating Temperature Range(C)||-40 to 85,0 to 70|
|BW @ Acl(MHz)||100|
|Iq per channel(Typ)(mA)||8.3|
|Vn at Flatband(Typ)(nV/rtHz)||2.4|
|Package Group||SO PowerPAD|
|Pin nb||Package type||Ind std||JEDEC code||Package qty||Carrier||Device mark||Width (mm)||Length (mm)||Thick (mm)||Pitch (mm)|
|• Active Output Impedance for ADSL Line Drivers
Signal termination is very common in bidirectional communication systems. Termination allows for receiving signals while transmitting different signals at the same time. With the increasing popularity of asymmetrical digital subscriber lines (ADSL), the re | Doc
|• Noise Analysis for High Speed Op Amps (Rev. A)
As system bandwidths have increased, an accurate estimate of the noise contribution for each element in the signal channel has become increasingly important. Many designers are not, however, particularly comfortable with the calculations required to predic | Doc
|THS6032 PSpice Model (Rev. B) - ZIP (10/04/2011)|
|THS6032 TINA-TI Spice Model (Rev. A) - ZIP (10/04/2011)|
Central Office 1.35-W Total Power Dissipation for Full-Rate ADSL Into a 25- Load Low-Impedance Shutdown Mode Allows Reception of Incoming Signal During Standby Two Modes of Operation Class-G Mode: 4 Power Supplies, 1.35 W Power Dissipation Class-AB Mode: 2 Power Supplies, 2 W Power Dissipation Low Distortion THD = 62 dBc = 1 MHz, VO(PP) V, 25- Load THD = 69 dBc = 1 MHz, VO(PP) V, 25- Load 400-mA Minimum Output Current Into a 25- Load High Speed 65-MHz Bandwidth , 25- Load 100-MHz Bandwidth , 100- Load 1200 V/µs Slew Rate Thermal Shutdown and Short Circuit Protection Evaluation Module AvailableTHERMALLY ENHANCED SOIC (DWP) PowerPAD PACKAGE (TOP VIEW)
NC Not Connected This terminal is internally connected to the thermal pad. MicroStar Junior (GQE) PACKAGE (TOP VIEW)description
The is a low-power line driver ideal for asymmetrical digital subscriber line (ADSL) applications. This device contains two high-current, high-speed current-feedback drivers, which can be configured differentially for driving ADSL signals at the central office. The THS6032 features a unique class-G architecture to lower power consumption 1.35 W. The THS6032 can also be operated in a traditional class-AB mode to reduce the number of power supplies to two.
HIGH-SPEED xDSL LINE DRIVER/RECEIVER FAMILY DEVICE THS6072 THS7002 DRIVER RECEIVER ±15 V DESCRIPTION 500-mA differential line driver and receiver 500-mA differential line driver 250-mA differential line driver 500-mA low-power ADSL central-office line driver Low-noise ADSL receiver Low-power ADSL receiver Low-noise programmable-gain ADSL receiver
CAUTION: The THS6032 provides ESD protection circuitry. However, permanent damage can still occur if this device is subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance degradation or loss of functionality. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD and MicroStar Junior are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
The class-G architecture supplies current to the load from four supplies. For low output voltages (typically < +2.5), some of the output current is supplied from the +VCC(L) and VCC(L) supplies (typically ± 5 V). For large output voltages (typically 2.5 and + 2.5), the output current is supplied from +VCC(H) and VCC(H) (typically ± 15 V). This current sharing between VCC(L) and VCC(H) minimizes power dissipation within the THS6032 output stages for high crest factor ADSL signals. The THS6032 features a low-impedance shutdown mode, which allows the central office to receive incoming calls even after the device has been shut down. The THS6032 is available packaged in the patented PowerPAD package. This package provides outstanding thermal characteristics in a small-footprint surface-mount package, which is fully compatible with automated surface-mount assembly procedures. It is also available in the new MicroStar Junior BGA package. This package is only mm2 in area, allowing for high density PCB designs. Shutdown (SHDN1 and SHDN2) allows for powering down the internal circuitry for power conservation or for multiplexing. Separate shutdown controls are available for each channel on the THS6032. The control levels are TTL compatible. When turned off, each driver output is placed in a low impedance state which is determined by the voltage at DGND. This virtual ground at the outputs allows proper termination of a transmission line.
AVAILABLE OPTIONS PACKAGED DEVICES TA PowerPAD PLASTIC SMALL OUTLINE (DWP) THS6032CDWP MicroStar Junior BGA (GQE) THS6032CGQER PowerPAD TQFP (VFP) THS6032CVFP EVALUATION MODULES
to 85°C The DWP packages are available taped and reeled. Add an R suffix to the device type (i.e.,THS6032CDWPR) The GQE packages are only available taped and reeled.
TERMINAL NAME 2IN 2IN+ VCCH VCCH+ VCCL VCCL+ SHDN1 SHDN2 DGND PAD NC DWP PACKAGE TERMINAL NO. GQE PACKAGE TERMINAL NO. J4 J7 N/A VFP PACKAGE TERMINAL NO. N/AMicroStar Junior (GQE) PACKAGE (TOP VIEW)
NOTE: Shaded terminals are used for thermal connection to the ground plane. VFP PACKAGE (TOP VIEW)
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