|Datasheet||Download BF3506 datasheet
FEATURES AND BENEFITS COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES, TRANSISTORS AND PASSIVE COMPONENTS. EXCELLENT THERMAL TRANSFER JUNCTION TI HEATSINK UL PENDING
DESCRIPTION The Bridges series from SGS-THOMSON has been designed to allow a better standardization of packages on boards principally designed with ISOTOP packages. The insulated package of the bridge will be able to sit on heatsink with other components. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advantage in these industry package products.MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (per diode unless specified)
Symbol VRRM VRSM IF(AV) total IFSM I2.t Tstg Tj Pmax total Parameter Repetitive peak reverse voltage Non repetitive peak reverse voltage Average forward current Surge non repetitive forward current 50Hz JEDEC method Fusing Storage temperature range Max. operating junction temperature Total power dissipation Tc=80°C Sinus Value to Unit °C WSymbol Rth (j-c) total Junction to case Parameter Value 0.5 Unit °C/W
ELECTRICAL CHARACTERISTICS (Per diode) STATIC CHARACTERISTICS
Symbol IR * Parameter Reverse leakage current Test Conditions = 0.8 VRRM = 125°C Min. Typ. Max. Unit mA V
Pulse test = 5 ms, duty cycle = 380 µs, duty cycle 2 % For one diode: Pcond 1.02 x IF(AV) x I2F(RMS) and Tj = Pcond 4 x Rth(j-c) + TcCooling method : C Marking : Type number Weight 28 g. (without screws)
- Recommended torque value : 1.3 N.m (MAX 1.5 N.m) for the x M4 screws. x M4 screws recommended for mounting the package on the heatsink and the 4 screws given with the screw version). - The screws supplied with the package are adapted for mounting on a board (or other types of terminals) with a thickness 0.6 mm min and 2.2 mm max.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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