Details, datasheet, quote on part number: ISP1507-AX-RS
PartISP1507-AX-RS
Category
TitleBluetooth/802.15.1 Modules ISP1507-AX BLE Module with Antenna 512 K Flash/ 64 K Ram - Reel of 500 units
Description
CompanyInsight SiP
DatasheetDownload ISP1507-AX-RS datasheet
  
ISP1507-AX-RS photo

Others parts numbering
ISP1507-AX-EB: Bluetooth/802.15.1 Development Tools Evaluation Board of ISP1507-AX
ISP1507-AX-TB: Bluetooth/802.15.1 Development Tools Test Board of ISP1507-AX
ISP1507-AX-DK: Bluetooth/802.15.1 Development Tools Development Kit of ISP1507-AX
ISP1507-AX-ST: Bluetooth/802.15.1 Modules ISP1507-AX BLE Module with Antenna 512 K Flash/ 64 K Ram - standard tray or cut and tape
ISP1507-AX-JT: Bluetooth/802.15.1 Modules ISP1507-AX BLE Module with Antenna 512 K Flash/ 64 K Ram - Jedec Tray
ISP1507-AX-R2: Bluetooth/802.15.1 Modules ISP1507-AX BLE Module with Antenna 512 K Flash/ 64 K Ram - Reel of 2000 units

 

Features, Applications
ISP1507 High Performance Bluetooth 5 Ready, NFC & ANT Low Energy Module with MCU & Antenna

This ultra-small LGA module, mm, is based on the nRF52832 Chip. Its powerful CortexTM M4 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. Multiple digital and analogue interfaces give optimum flexibility for sensor integration.

Multi-protocol 2.4GHz Ultra Low Power RF Transceiver Bluetooth 5-Ready stack ANT/ANT+ stack 2.4 GHz proprietary stack NFC-A Tag for OOB pairing Fully integrated RF matching and Antenna Integrated 32 MHz & 32kHZ Clock DC/DC converter with loading circuit Based on Nordic Semiconductor nRF52 32-bit ARM Cortex M4 CPU 512 kB Flash 64 kB SRAM Configurable 30 GPIOs including 8 ADC Many interfaces SPI, UART, PDM, I2C Single 3.6 V supply Very small size 1.0 mm Temperature +85 °C

Applications

Connected sensors for medical devices, healthcare, sport, fitness, industrial... IoT applications, connected objects Wearable technology Home automation Beacons

Fully FCC certified module Fully CE certified module Fully IC certified module Fully TELEC certified module Bluetooth SIG certified QDL listing RoHS compliant

October 5, 2017 Document Ref: isp_ble_DS1507_R7.docx Page 1/23 Insight SiP ­ Green Sid ­ 400 aven ue Rou m anille 06906 So phia - Antip olis Ce dex ­ Fra nce ­ www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

Block Diagram.......................................................................................................................................................... 3 Specifications........................................................................................................................................................... 4 Absolute Maximum Ratings...........................................................................................................................4 Operating Conditions....................................................................................................................................4 Power Consumption......................................................................................................................................5 Clock Sources...............................................................................................................................................5 Radio Specifications......................................................................................................................................5 Electrical Schematic......................................................................................................................................8 Pin Description......................................................................................................................................................... 9 Mechanical Outlines............................................................................................................................................... 11 Mechanical Dimensions.............................................................................................................................. 11 SMT Assembly Guidelines.......................................................................................................................... 12 Antenna Keep-Out Zone............................................................................................................................. 12 Product Development Tools................................................................................................................................. 13 Hardware.................................................................................................................................................... 13 Firmware.................................................................................................................................................... 13 Development Tools..................................................................................................................................... 14 Reference Designs................................................................................................................................................. 15 Beacon Design........................................................................................................................................... 15 Packaging & Ordering information...................................................................................................................... 16 Marking....................................................................................................................................................... 16 Prototype Packaging................................................................................................................................... 16 Jedec Trays................................................................................................................................................ 16 Tape and Reel............................................................................................................................................ 17 Ordering Information................................................................................................................................... 18 Storage & Soldering information.......................................................................................................................... 19 Storage and Handling................................................................................................................................. 19 Moisture Sensitivity..................................................................................................................................... 19 Soldering information.................................................................................................................................. 20 Quality & User information.................................................................................................................................... 21 Certifications............................................................................................................................................... 21 USA ­ User information.............................................................................................................................. 21 Canada ­ User information......................................................................................................................... 21 RF Exposure Information............................................................................................................................ 22 Informations concernant l'exposition aux fréquences radio (RF).................................................................. 22 Discontinuity............................................................................................................................................... 22 Disclaimer................................................................................................................................................... 23

October 5, 2017 Document Ref: isp_ble_DS1507_R7.docx Page 2/23 Insight SiP ­ Green Sid ­ 400 aven ue Rou m anille 06906 So phia - Antip olis Ce dex ­ Fra nce ­ www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

This module is based on nRF52832 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC) integrating a 2.4 GHz transceiver, a 32-bit ARM CortexTM-M4 CPU, 512 kB flash memory, 64 kB RAM and analog and digital peripherals. It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from Nordic Semiconductor. Fully qualified BLE stacks for nRF52832 are implemented in the S132 SoftDevices which can be freely downloaded. ISP1507 can then be used in Central, Peripheral or both roles for BLE and for both ends of other proprietary protocols. nRF52832 platform also provides extensive software support for ANT applications with S212 SoftDevices and dual ANT/BLE stack S332 SoftDevices. Ultra low power consumption and advanced power management enables battery lifetimes up to several years on a coin cell battery. Even though its very small size 1.0 mm, the module integrates decoupling capacitors, 32 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter, RF matching circuit and antenna in addition to the wireless SoC. Only the addition of a suitable DC power source is necessary for BLE and/or ANT connectivity. Sensor applications require the further addition of appropriate sensors. The antenna was designed to be optimized with several standard ground plane sizes. The NFC tag antenna can be connected externally.

October 5, 2017 Document Ref: isp_ble_DS1507_R7.docx Page 3/23 Insight SiP ­ Green Sid ­ 400 aven ue Rou m anille 06906 So phia - Antip olis Ce dex ­ Fra nce ­ www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.


 

Some Part number from the same manufacture Insight SiP
ISP1507-AX-EB
ISP1507-AX-TB
ISP1507-AX-DK
ISP1507-AX-ST
ISP1507-AX-JT
ISP1507-AX-R2
 
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