Details, datasheet, quote on part number: ISP130301-BL-RS
PartISP130301-BL-RS
Category
TitleBluetooth/802.15.1 Modules ISP130301-BL BLE Module with Antenna 256 K Flash/ 32 K Ram - Reel of 500 units
Description
CompanyInsight SiP
DatasheetDownload ISP130301-BL-RS datasheet
  
ISP130301-BL-RS photo

Others parts numbering
ISP130301-BL-EB: Bluetooth/802.15.1 Development Tools Evaluation Board of ISP130301-BL
ISP130301-BL-TB: Bluetooth/802.15.1 Development Tools Test Board of ISP130301-BL
ISP130301-BL-ST: Bluetooth/802.15.1 Modules ISP130301-BL BLE Module with Antenna 256 K Flash/ 32 K Ram - standard tray or cut and tape
ISP130301-BL-DK: Bluetooth/802.15.1 Development Tools Development Kit of ISP130301-BL
ISP130301-BL-R2: Bluetooth/802.15.1 Modules ISP130301-BL BLE Module with Antenna 256 K Flash/ 32 K Ram - Reel of 2000 units
ISP130301-BL-JT: Bluetooth/802.15.1 Modules ISP130301-BL BLE Module with Antenna 256 K Flash/ 32 K Ram - Jedec Tray

 

Features, Applications
ISP130301 High Performance Bluetooth & ANT(1) Low Energy Module with MCU and Antenna

This tiny LGA module, x 1.2 mm, is based on the nRF51 series Chip. Its powerful CortexTM M0 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. All chip digital and analogue interfaces are available and give optimum capabilities for sensor integration.

Single Mode BLE V4.2 Compliant (1) ANT+ protocol in option IPv6 Connectivity ECDH Encryption Based on Nordic Semiconductor nRF51 2.4GHz low energy RF Transceiver 32bit ARM Cortex M0 CPU 256 kB Flash 32 kB SRAM in option 30 GPIOs including 6 ADC inputs and or 2 ADC reference Ultra Low Power Consumption Single 3.6 V supply Very small size 1.2 mm Temperature +85 C Fully integrated RF matching and Antenna Integrated 16 MHz Clock Integrated 32.768 kHz Synchronization DC-DC loading circuit fully integrated

Applications

Connected sensors for medical devices, healthcare, sport, fitness, industrial... IoT applications, connected objects Wearable technology Home automation Beacons

Bluetooth SIG certified QDL listing Fully CE certified module Fully FCC certified module Fully IC certified module Fully IMOC certified module Fully TELEC certified module RoHS compliant

January 16, 2017 Document Ref: isp_ble_DS130301_R13.docx Page 1/24 Insight SiP Green Side 400 avenue Roumanille 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

Block Diagram............................................................................................................................................................ 3 Specifications............................................................................................................................................................. 4 Absolute Maximum Ratings........................................................................................................................... 4 Operating Conditions..................................................................................................................................... 4 Power Consumption...................................................................................................................................... 5 Clock Sources............................................................................................................................................... 5 Radio Specifications...................................................................................................................................... 5 Electrical Schematic...................................................................................................................................... 8 Pin Description........................................................................................................................................................... 9 Mechanical Outlines................................................................................................................................................11 Mechanical Dimensions.............................................................................................................................. 11 SMT Assembly Guidelines.......................................................................................................................... 12 Antenna Keep-Out Zone............................................................................................................................. 13 Product Development Tools..................................................................................................................................14 Hardware..................................................................................................................................................... 14 Firmware...................................................................................................................................................... 14 Development Tools..................................................................................................................................... 15 Reference Designs..................................................................................................................................................16 Sensor Board Design.................................................................................................................................. 16 Beacon Design............................................................................................................................................ 17 Packaging & Ordering information.......................................................................................................................18 Marking........................................................................................................................................................ 18 Prototype Packaging................................................................................................................................... 18 Jedec Trays................................................................................................................................................. 18 Tape and Reel............................................................................................................................................. 19 Ordering Information................................................................................................................................... 20 Storage & Soldering information..........................................................................................................................21 Storage and Handling.................................................................................................................................. 21 Moisture Sensitivity..................................................................................................................................... 21 Soldering information.................................................................................................................................. 22 Quality & User information.....................................................................................................................................23 Certifications................................................................................................................................................ 23 USA User information............................................................................................................................... 23 Canada User information......................................................................................................................... 23 Discontinuity................................................................................................................................................ 24 Disclaimer.................................................................................................................................................... 24

January 16, 2017 Document Ref: isp_ble_DS130301_R13.docx Page 2/24 Insight SiP Green Side 400 avenue Roumanille 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

This module is based on nRF51 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC) integrating a 2.4 GHz transceiver, a 32-bit ARM CortexTM-M0 CPU, a flash memory, a RAM and analog and digital peripherals. It can support Bluetooth Low Energy and 2.4GHz proprietary ultra low-power wireless protocols, such as Gazell from Nordic Semiconductor. The ANT / ANT+TM protocol can be handled in option. Fully qualified BLE stacks for nRF51 are implemented in the S100 series of SoftDevices which can be freely downloaded. ISP130301 can then be used in Central, Peripheral or both roles for BLE and for both ends of other proprietary protocols. nRF51 platform also provides extensive software support for ANT applications with S210 SoftDevices and dual ANT/BLE stack S310 SoftDevices. Ultra low power consumption and advanced power management enables battery lifetimes up to several years on a coin cell battery. Even though its very small size x 1.2 mm, the module integrates decoupling capacitors, 16 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter, RF matching circuit and antenna in addition to the wireless SoC. Only the addition of a suitable DC power source is necessary for BLE and/or ANT connectivity. Sensor applications require the further addition of appropriate sensors. The antenna was designed to be optimized with several standard ground plane sizes.

January 16, 2017 Document Ref: isp_ble_DS130301_R13.docx Page 3/24 Insight SiP Green Side 400 avenue Roumanille 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.


 

Some Part number from the same manufacture Insight SiP
ISP130301-BL-EB
ISP130301-BL-TB
ISP130301-BL-ST
ISP130301-BL-DK
ISP130301-BL-R2
ISP130301-BL-JT
ISP1302-BS-RS
ISP1302-BS-EB
ISP1302-BS-TB
ISP1302-BS-DK
ISP1302-BS-ST
ISP1302-BS-R2
ISP1302-BS-JT
ISP1507-AX-RS
ISP1507-AX-EB
ISP1507-AX-TB
ISP1507-AX-DK
ISP1507-AX-ST
ISP1507-AX-JT
ISP1507-AX-R2
 
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